Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits

Abstract The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided.