Degradation behavior of heat-treatment silicate adhesive under special working conditions

Abstract Inorganic adhesive is widely used in the sealing and connection of electronic devices. Its insulation is highly important in the performance of installation. In this paper, the insulation resistance and tensile strength of different composite silicate samples were measured by test machines. The morphology and surface composition were analyzed by electronic microscope and energy spectrum analyzer. The results show that: In a humid environment, the resistance insulation of adhesive increases with the rising of heat treatment temperature, and decreases with the increment of wet environment. When the modulus ratio of colloidal liquid is in the range of 7.2~9.1 and the heat-treatment temperature is larger than 600°C, the effect of moisture resistant is remarkable. The tensile strength of adhesive deteriorates with the increasing of humidity. Furthermore, with ascending heat treatment temperature, the tensile strength rises when the modulus ratio of adhesive is less than 7.2, and declines when it is more than 9.1.