聚酰亚胺
热固性聚合物
形状记忆聚合物
形状记忆合金
韧性
压缩成型
极限抗拉强度
聚合物
材料科学
低聚物
造型(装饰)
模数
断裂韧性
高分子化学
复合材料
模具
图层(电子)
作者
Zenghui Yang,Chunjian Duan,Yong Sun,Tingmei Wang,Xinrui Zhang,Qihua Wang
标识
DOI:10.1021/acs.iecr.9b01405
摘要
Integrating good strength and toughness, high thermostability, and easy processability into one shape memory polymers is highly desirable yet challenging. Herein, we demonstrate an approach to fabricate high temperature shape memory polymer based on polyhexahydrotriazines (PHT) cross-linked polyimide oligomers. The obtained thermosets with enhanced thermal and mechanical properties can comparable to well-established high molecular weight polyimide. The thermoset with molecular weight of polyimide oligomer as low as 8 kg/mol (PI8k-PHT) exhibit the tensile strength, fracture toughness, and elastic modulus of 90 MPa, 69 MJ/m3, and 2059 MPa, respectively. The PI8k-PHT show good shape memory effect at 210 °C with shape fixity above 98% and shape recovery above 90%, and their temporary shapes quickly recover to original within 4 s under thermal stimulus. Besides, utilizing the partially cured prepregs sheets and further compression molding methods, the block or surface micropatterned shape memory composites can be facilely obtained.
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