材料科学
复合材料
悬臂梁
巴黎法
疲劳极限
强度因子
放松(心理学)
压力(语言学)
裂缝闭合
分析化学(期刊)
断裂力学
化学
社会心理学
哲学
色谱法
语言学
心理学
作者
Jared S. Aaldenberg,Peter J. Lezzi
摘要
Abstract The static fatigue limit, or the threshold stress intensity factor, K o , for first subcritical crack growth has been measured directly in silica glass for T ≥ 600°C using the double cantilever beam (DCB) crack growth technique. Values measured ranged from 0.48 to 0.61 MPa·m 1/2 for a temperature range of 600°C‐850°C, respectively. Cracks growing near the static fatigue limit had a time‐dependence, where the crack growth decreased and appeared to stop at K ≈ K o . Slow crack growth curves ( K ‐ v ) have been measured from room temperature, 50% RH, up to 850°C with subcritical crack growth not measurable for T > 900°C. Increasing temperature was found to first increase, and then decrease the slope of Region I, and a peak in fatigue resistance was found around 150°C‐300°C. At T > 600°C subcritical crack growth was observed for K higher than previously measured K IC values. This observation and the static fatigue limit in silica are explained by a water‐assisted stress relaxation mechanism at the crack tip.
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