沟槽
JFET公司
材料科学
MOSFET
光电子学
双闸门
电压
电气工程
纳米技术
场效应晶体管
工程类
晶体管
图层(电子)
作者
Yuki Nakano,Ryota Nakamura,Hiroyuki Sakairi,Shuhei Mitani,Takashi Nakamura
出处
期刊:Materials Science Forum
日期:2012-05-14
卷期号:717-720: 1069-1072
被引量:35
标识
DOI:10.4028/www.scientific.net/msf.717-720.1069
摘要
The trench gate structure MOSFET, with its lack of JFET resistance, is one of the structures able to achieve low on-state resistance [1,2]. In 2008, this group succeeded in fabricating 790V SiC trench MOSFETs with the lowest R on,sp (1.7 mΩcm 2 ) at room temperature. However these devices had issues regarding oxide destruction at the trench bottom during high drain-source voltage application. In order to improve this problem, this group developed the double-trench MOSFET structure. This structure has both source trenches and gate trenches. This paper compares two kinds of trench MOSFETs: the conventional, single trench structure and a double-trench structure. Also, the latest characteristics are presented.
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