Unveiling surface and subsurface atomic vacancies in MoS2 with lateral force microscopy

材料科学 原子力显微镜 曲面(拓扑) 显微镜 化学物理 纳米技术 导电原子力显微镜 凝聚态物理 结晶学 磁力显微镜 曲面重建 光导原子力显微镜 分子物理学 表面结构 开尔文探针力显微镜
作者
Oscar Gutiérrez-Varela,Aitor Zambudio,Pablo Ares,Julio Gómez‐Herrero,Enrico Gnecco,J. Colchero,Jose Guilherme Vilhena,Cristina Gómez‐Navarro
出处
期刊:Nature Communications [Nature Portfolio]
卷期号:17 (1)
标识
DOI:10.1038/s41467-026-75151-0
摘要

Atomic-scale defects govern materials properties, with their influence amplified in low-dimensional systems. Understanding and controlling such defects is therefore essential for both fundamental science and technological applications. However, precise defect identification and localization remain major challenges. Lateral force microscopy (LFM), an atomic force microscopy mode that measures friction forces through the lateral torsion of the cantilever, is an appealing technique for probing surface properties. Nevertheless, it has conventionally been regarded as insensitive to structural features beneath the topmost atomic layer. In this study, we overturn this paradigm by demonstrating that LFM can not only detect but also classify atomic vacancies in MoS2 according to their depth. By combining experiments with molecular dynamics and Prandtl-Tomlinson (PT) modeling, we identify unique frictional fingerprints associated with each defect type: surface vacancies produce a characteristic ’drop-and-rise’ signature, whereas subsurface vacancies generate a pronounced exit barrier without an entry drop. While molecular dynamics validates these specific MoS2 signatures, the PT model reveals a generic, geometric lattice-disruption mechanism, extending the validity of our findings beyond MoS2. Furthermore, we apply these findings to compare the defect density and defect types in MoS2 flakes obtained via chemical vapor deposition (CVD) and mechanical exfoliation. In this work, friction imaging is shown to detect atomic defects in MoS2, even when hidden below the surface, and to classify them through distinct friction fingerprints. This approach offers an accessible way to assess ultrathin material quality.
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