Recent Advances in UV ‐Curable Resins for Flexible Electronic Devices—Formulations, Properties, and Applications

ABSTRACT Nowadays, UV‐curing technology has been widely used in the fields of coatings, inks, adhesives and so on. Compared to thermal curing methods, UV photopolymerization has the advantage of efficiency, energy saving, enabling, economical and environmentally friendly. As a core raw material of UV‐curable products, UV resin is the basis for their efficient and precise curing. Research on the preparation and performance of flexible electronic devices has attracted extensive global attention in recent years. Photocuring technology has been considered an ideal method to produce flexible electronic devices. Currently, there are exhaustive reviews on nanofillers, hydrogels, biomaterials, and smart materials for flexible electronic devices. The review focusing on photocurable resins for flexible electronics is still lacking. In this review, the initiators, initiation mechanisms, monomer types, and fillers for photo‐polymerizable resins are introduced. Then the rheological properties, mechanical properties and electrical conductivity of UV‐polymerizable resins are characterized by macro‐ and microstructures. Next, the applications of photocurable resins in conductive fillers, sensors, thermally conductive materials, electronic packages, and other electronic devices are presented. Finally, the development directions of UV‐curable resins in the field of flexible electronics are proposed.