材料科学
电解质
电导率
氧化铟锡
聚乙烯吡咯烷酮
纳米线
薄板电阻
纳米技术
接触电阻
化学工程
氧化物
纳米
图层(电子)
复合材料
电极
冶金
工程类
物理化学
化学
高分子化学
作者
Jiahui Gu,Xuelin Wang,Hongtao Chen,Shihua Yang,Huanhuan Feng,Xing Ma,Hongjun Ji,Jun Wei,Mingyu Li
出处
期刊:Nanotechnology
[IOP Publishing]
日期:2018-04-05
卷期号:29 (26): 265703-265703
被引量:12
标识
DOI:10.1088/1361-6528/aabbbc
摘要
As a promising replacement material for indium tin oxide in flexible electronics, silver nanowires (AgNWs) usually need complicated post-treatment to reduce the high contact resistance across the intersections when used as transparent conductive films. In this work, a widely applicable nano-joining method for improving the overall conductivity of AgNW networks with different kinds of electrolyte solutions is presented. By treatment with an electrolyte solution with appropriate ionic strengths, the insulating surfactant layer (polyvinylpyrrolidone, PVP) on the AgNWs could be desorbed, and the AgNW network could be densified. The sheet resistance of the AgNW film on a glass slide is reduced by 60.9% (from 67.5 to 26.4 Ohm sq-1) with a transmittance of 92.5%. High-resolution transmission electron microscopy analysis indicates that atomic diffusion occurs at the intersection of two AgNWs. Thus, metallurgical bonding on the nanometer scale is achieved across the junctions of the AgNWs, leading to a significant enhancement in the conductivity of the AgNW network.
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