材料科学
电子迁移率
MOSFET
异质结
光电子学
硅锗
CMOS芯片
基质(水族馆)
应变硅
频道(广播)
缩放比例
锗
工程物理
硅
电子工程
晶体管
电气工程
电压
晶体硅
工程类
非晶硅
海洋学
几何学
数学
地质学
作者
Eugene A. Fitzgerald,M. L. Lee,C. W. Leitz,D.A. Antoniadis,Anthony Lochtefeld,R. Hammond,M. T. Currie,G. Braithwaite,F. Singaporewala,Jee-Hoon Yap,C.J. Vineis,N. D. Gerrish,R. Westhoff,M. T. Bulsara,Jackson Ho,J. R. Hwang,Yao‐Jen Hsieh,T. P. Chen,Anthony Lee,T. Y. Chen
标识
DOI:10.7567/ssdm.2002.a-4-1
摘要
Biaxial tensile strained Si grown on SiGe virtual substrates will be incorporated into future generations of CMOS technology due to the lack of performance increase with scaling.Compressively strained Ge-rich alloys with high hole mobilities can also be grown on relaxed SiGe.We review progress in strained Si and dual channel heterostructures, and also introduce high hole mobility digital alloy heterostructures.By optimizing growth conditions and understanding the physics of hole and electron transport in these devices, we have fabricated nearly symmetric mobility p-and n-MOSFETs on a common Si 0.5 Ge 0.5 virtual substrate.
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