跨导
运算跨导放大器
共栅
公共来源
电子工程
增益-带宽产品
放大器
带宽(计算)
CMOS芯片
电气工程
运算放大器
计算机科学
晶体管
工程类
电信
电压
作者
Y.L. Li,Ki-Jung Han,Xiaofeng Tan,Ning Yan,Hyang Ki Min
出处
期刊:Electronics Letters
[Institution of Engineering and Technology]
日期:2010-09-16
卷期号:46 (19): 1321-1323
被引量:88
摘要
An improved recycling structure for an operational transconductance amplifier is proposed. The proposed structure separates the AC path from the DC path, and achieves a significant boost in transconductance under the same power and area budget. A folded-cascode amplifier employing the improved recycling structure was implemented in SMIC standard 0.13 µm CMOS process. Simulation results show that the enhancement of transconductance leads to 230% improvement in gain-bandwidth product and 13 dB boost in gain compared with the conventional folded cascode.
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