偷看
复合数
复合材料
材料科学
大气压力
大气压等离子体
圆周率
等离子体
化学工程
化学
物理
聚合物
工程类
气象学
核物理学
生物化学
作者
Jing Wang,Shuang Yang,Cunyong Xiao,Z.M. Yu,Rong Ren,Xuhai Xiong
摘要
Abstract Since the properties of surface roughness with time and the wettability pattern of polymer surfaces transformed by plasma remain unclear. In order to understand the mechanism of aging effect on film properties, this paper analyzes the aging of plasma‐treated PI films. The optimal treatment conditions were first explored by adjusting the plasma treatment power. Based on the effect of plasma treatment power on the surface physicochemical properties and mechanical properties of PI films. It was found that the content of oxygen‐containing functional groups on the surface of the film was highest at a plasma treatment power of 800 W, and the surface energy reached a maximum value of 67.71 mJ/m 2 . As the treatment power increases, the surface etching of the PI film increases significantly, as does the roughness. However, if the power is too high, it can cause excessive etching, resulting in peeling of the film surface. In addition, the mechanical properties of the films decreased with increasing plasma treatment power. Based on the effect of plasma treatment power on the surface physicochemical and mechanical properties of PI films, the best overall modification effect of PI films was determined when the treatment power was 800 W and the speed was 6 mm/s. And at 800 W, the peel strength of the PI/PEEK composite film reached a maximum value of 9.55 N/cm, which was 77.84% higher than that of the untreated composite film. However, plasma‐treated PI films can experience surface remodeling after being exposed to air for a period of time. In this paper, the wettability as well as the mechanical properties of the films are analyzed for different aging times. The results showed that after 30 days of plasma treatment, the O/C and N/C contents on the surface of the PI film decreased, and the wettability performance decreased by 19.45% compared with that of the recently treated film.
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