Dynamic Mechanical Properties and Constitutive Model of SiC/Al Considering High Strain Rate and High/Low Temperatures

Silicon carbide (SiC)/aluminum (Al) composites have become the preferred material for packaging of electronic components due to their superior mechanical and physical properties. In this study, the dynamic response of SiC/Al is investigated at different temperatures and different strain rates. Dynamic compression experiments are conducted on composite material using a Split Hopkinson pressure bar (SHPB) apparatus over a temperature range from −80 to 600 °C and at strain rates from 1000 to 7000 s −1 . The mechanical properties of the material are studied, and the detailed microstructure of the compression test is analyzed in the experiment. Based on the results of dynamic and quasistatic compression experiments, the temperature softening coefficient and strain rate hardening parameter of the Johnson–Cook constitutive model are fitted, and the Johnson–Cook constitutive model of SiC/Al under high and low temperatures and high strain rate was established. The results indicate that the flow of stress and brittleness increase at low temperatures, whereas in high‐temperature environments, plasticity is enhanced, and the yield stress is reduced. Compared to the traditional Johnson–Cook constitutive model, the modified model proposed in this study significantly improves prediction accuracy of experimental results, with values of E RMSE and E MAPE decreasing by 80.28% and 84.43%, respectively.