放大器
变压器
电气工程
材料科学
多尔蒂放大器
光电子学
电子工程
计算机科学
射频功率放大器
工程类
电压
CMOS芯片
标识
DOI:10.1109/isscc49657.2024.10454274
摘要
Mm-wave wireless communication and sensing heavily rely on phased arrays to compensate for high path losses and meet link-budget targets. Recent mm-wave arrays have grown increasingly complex, often with many parallel RF paths integrated on a single front-end/beamformer chip [1]. Dual-polarization and multiband operation further multiply the number of RF front-end paths. Consequently, one technology trend of array front-end chips is to aggressively miniaturize RF building blocks for integration and cost saving, while simultaneously achieving higher energy efficiency to maintain the thermal density and ease the packaging.
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