Integration Of Micro Surface Mount Components On Printed Circuit Board By micro-Transfer Printing

Evolution of the integrated circuit manufacturing requires the integration of more circuit components on a printed circuit board (PCB) through shrinking device sizes and reducing component spacing. For this reason, the placement of micro surface mount components (SMCs) has become an important part of high-density integrated circuit manufacturing. For the 01005 series resistors, the size of the air holes in the nozzle of the mounter based on the vacuum adsorption system is limited, and the air holes are easily blocked, making it difficult to place them. Thanks to the advantages of small size, high-density integration, micro-transfer printing (μTP) is expected to solve the problem of blocking the air holes of the placement equipment, providing a new way for the high-density integration of miniature chip components. Aiming at the trend of high-density circuitry and miniaturization of components as well as the difficulty of micro SMCs placement, this paper applies the μTP method on the placement of SMCs by transferring the components to the pads of the PCB through the transfer medium. Experiments have successfully been done on the placement 01005, 0201, 0402 series of SMCs, and the error of the printed sample is limited to within 1.5 %.