Interfaces of the 5083Al/1060Al/TA1/Ni/SUS304 five-layer composite plate fabricated by explosive welding

The 5083Al/1060Al/TA1/Ni/SUS304 five-layer composite plate was fabricated successfully by explosive welding to improve the bond strength. The four interfaces exhibited wave structures that exhibited significantly different wavelengths and amplitudes. The microstructure of the interfaces underwent a certain degree of dynamic recovery and recrystallization which displayed refined grain with different preferred orientations. Intermetallic phases such as Al3Ti, Al2Ti, AlTi, and Ti3 Al were observed at the 1060Al/TA1 interface. The TiNi3, Ti2Ni, and TiNi phases were found at the TA1/Ni interface. The α′ martensite, Cr7C3, Fe3C, and Ni3Fe phases were found at the Ni/SUS304 interface. Microhardness at each interface was the highest and gradually decreased away from the interface. The tensile-shear strength of each interface prominently exceeded the corresponding acceptable standard value. In addition, the average pull-off strength was 173 MPa, and the sample fractured at the 5083Al/1060Al interface. The excellent bonding strength was mainly attributed to the ideal periodical wave structure and the refined grain at each interface.