极紫外光刻
平版印刷术
材料科学
极端紫外线
X射线光刻
下一代光刻
抵抗
星团(航天器)
金属
锌
光电子学
氧化物
纳米技术
电子束光刻
光学
冶金
激光器
计算机科学
物理
程序设计语言
图层(电子)
作者
Kazunori Sakai,Seok‐Heon Jung,Wenyang Pan,Emmanuel P. Giannelis,Christopher K. Ober
摘要
Extreme ultraviolet (EUV) lithography, using 13.5 nm radiation, is a prominent candidate for next generation manufacturing. Our main effort has recently focused on metal organic cluster photoresists, including both Zr and Hf metal oxides, both relatively low EUV absorbing metals. However, integration of high EUV absorption elements is now considered to be a more promising route to further improve lithographic performance under EUV radiation. Here, we report lithography of zinc oxide-based metal organic cluster photoresists, and EUV patterning below 15 nm. The lithographic performance of this and other metal oxides is described and etch characteristics discussed.
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