金属浇口
材料科学
金属
晶体管
电子迁移率
降级(电信)
锡
光电子学
感应高电子迁移率晶体管
电气工程
高电子迁移率晶体管
栅氧化层
冶金
电压
工程类
作者
M. Cassé,X. Garros,Laurent Brunet,G. Reimbold
出处
期刊:ECS transactions
[Institute of Physics]
日期:2010-04-16
卷期号:28 (1): 165-176
被引量:3
摘要
We have investigated the effect of the nitrided metal gate (such as TiN or TaN) on the carrier mobility in high-k/metal gate transistors. N-induced defects are evidenced and correlated to the electron mobility degradation. Hole behavior is compared and found to differ significantly. Al integration in advanced metal gate is also found to degrade the electron mobility in a similar way as N.
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