Thermal Processing Map and Microstructure Evolution of Inconel 625 Alloy Sheet Based on Plane Strain Compression Deformation

Plane strain compression tests were used to study the deformation behavior of an Inconel 625 alloy sheet at various temperatures and strain rates. The peak stress was selected to establish the constitutive equation, and the processing maps under different strains were drawn. The results show that the effective stress–strain curve of Inconel 625 has typical dynamic recrystallization (DRX) characteristics. With the increasing deformation temperature and the decreasing strain rate, the softening effect is significantly enhanced. The parameters of the constitutive equation are calculated, and the average error of the constitutive equation is 5.68%. Through the analysis of the processing map, a deformation temperature of 950–960 °C with a strain rate of 0.007–0.05 s−1 were determined as the unstable region, and obvious local plastic-rheological zones were found in the unstable region. The optimum deformation condition was found to be 1020–1060 °C/0.005–0.03 s−1. Through electron backscattered diffraction (EBSD) characterization, it was found that both the increase of temperature and the decrease of strain rate significantly promote the recrystallization process. At a low strain rate, the main recrystallization mechanism is discontinuous dynamic recrystallization (DDRX). It is expected that the above results can provide references for the optimization of the rolling process and microstructure control of an Inconel 625 alloy sheet.