Study of thermal properties of poly (α-methyl styrene) and polyurethane and their fullerene-based interpenetrating polymer network

Thermal properties of pure poly (α-methyl styrene) (PAMS) and polyurethane (PU) and their fullerene based interpenetrating polymer network (IPN) was investigated by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA).Glass transition temperature (Tg) of pure PAMS and PU was recorded at 173 o C and 120 o C respectively and their thermal decomposition was found at 350 o C and 348 o C respectively and while glass transition temperature of their fullerene based IPN was recorded at 160 o C and thermal decomposition was found at 392 o C. A gradual increase in (Tg) value by the incorporation of vinyl polymer reveals the role fullerene as a nanomaterial in strengthening interpenetration as well as enhancement in thermal properties of reacting monomeric species.An enhanced thermal stability pattern of IPN than PAMS and PU was recorded, which indicates the incorporation of urethane and α-methyl styrene units into the polymeric network of fullerene surface.The conductivity pattern explains semiconductor character of the fabricated IPN.Scanning electron microscopic (SEM)exhibits dual phase morphology of IPN.Besides of these testing, IPN was also analyzed for permittivity and permeability which reveals enhanced dielectric as well as good electromagnetic properties.This interpenetration surely brings a great change in the various physiochemical and electrical properties and new class of IPN will be established.Such polymeric systems may be applicable in the field of semiconductor to a broader range.These IPN of moderate conductivity might be useful in the electronics science research area.