数码产品
材料科学
磁性
柔性电子器件
纳米技术
电子线路
电气工程
工程类
量子力学
物理
作者
Wenting Dai,Hang Xu,Chaonan Zhang,Ya Li,Huizhuo Pan,Hanjie Wang,Gaofeng Wei,Xian Huang
标识
DOI:10.1002/aelm.201900111
摘要
Abstract Development of flexible magnetoelectrical (ME) electronics has encountered huge challenges due to mechanical mismatch, environmental instability, and the weak electrical conductivity of extremely hard neodymium iron boron materials. A series of techniques involving mechanical milling, core–shell structure synthesis, printing electronics, and photonic sintering are developed to achieve composite materials and flexible ME devices demonstrated as sensors, circuit components, printed circuit boards circuits, and interfaces. These devices, which are mechanically compatible with the demands of flexible electronics, offer both excellent magnetism (coercivity >2800 Oe) and electrical conductivity (>41743 S m −1 ), allowing novel functions and simplified design that benefit from the coexistence and interaction of magnetic and electrical fields. These materials, devices, and process techniques serve as additions to the existing flexible‐electronics framework, and may also inspire development of more innovative ME devices and applications in biology, healthcare, industry, and consumer electronics.
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