High strain rate mechanical behavior of Ti-6Al-4V with micro–macro correlation under compressive loading

材料科学 电子背散射衍射 分离式霍普金森压力棒 纳米压痕 应变率 复合材料 微观结构 应变硬化指数 流动应力 粒度 弹性模量 动态再结晶 加工硬化 晶体孪晶 打滑(空气动力学) 热加工 物理 热力学
作者
Liqiang Chen,Lei Pan,Xuan Hu,Zhigang Sun,Xuming Niu,Yingdong Song,Yao Zheng
出处
期刊:Engineering Failure Analysis [Elsevier BV]
卷期号:157: 107913-107913
标识
DOI:10.1016/j.engfailanal.2023.107913
摘要

The application of Ti6Al4V in lightweight structures subjected to impact loads necessitates a comprehensive understanding of its dynamic response under high strain rates to ensure the safety and reliability of these components. In this paper, the macroscopic compressive mechanical behavior of Ti6Al4V under high strain rates was investigated through the split-Hopkinson pressure bar (SHPB) technique at both room temperature and 200 °C, followed by microstructure analysis of the compressed specimens, carried out employing a combination of optical microscopy (OM) and electron backscatter diffraction (EBSD), and elastic modulus and hardness measurements, performed by a nanoindentation instrument. At room temperature, both the modulus and strain hardening exponent of Ti6Al4V exhibited an initial increase before the strain rate reached 1000 s-1, after which they decreased at 3400 s-1. Meanwhile, the flow stress continued to rise with increasing strain rate. Microscopic observations revealed that twinning played a substantial role in the strain hardening effects. Notably, the basal slip system of the hcp (hexagonal close packed) α phase did not display a more favorable trend, while the c+a type slip systems became more active. Under a strain rate of 5000 s-1, discontinuous dynamic recrystallization emerged as the dominant mechanism, resulting in an increased frequency of low-angle grain boundaries, as well as a reduction in grain size and dislocation density. These results provide a basis for explaining the mechanical behavior of Ti6Al4V under high strain rates and offer insights for the establishment of material models that take into account microstructure deformation mechanisms.
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