CMOS芯片
偏压
材料科学
电压
电气工程
光电子学
电子工程
工程类
作者
Yixin Zhou,Keping Wang,Simeng Yin,Wenyuan Li,Fanyi Meng,Zhigong Wang,Kaixue Ma
出处
期刊:IEEE Transactions on Circuits and Systems I-regular Papers
[Institute of Electrical and Electronics Engineers]
日期:2024-03-25
卷期号:71 (6): 2525-2537
被引量:3
标识
DOI:10.1109/tcsi.2024.3376370
摘要
This paper presents a fully integrated stimulator using a dynamic bulk biasing technique and a dynamic control scheme in a 180-nm bulk CMOS technology. Unlike the conventional bulk biasing method, the bulk bias voltage is dynamically set according to the different stimulation phases. It avoids the underlying leakage current paths, and improves the maximum stimulation voltage compliance (MSVC). Together with dynamic bulk biasing scheme, a high voltage interface is designed to overcome the limitation of the breakdown voltage of the substrate diode ( V $_{\mathbf{BD}}$ ) between the high and low voltage domains. An all-NMOS dynamic charge pump is also proposed as a dynamic power supply above V $_{\mathbf{BD}}$ and provides dynamic bulk-biasing voltages. Fabricated in a 180-nm standard CMOS technology, the stimulator achieves an MSVC of $\pm$ 16.5 V under a 3.3-V supply, and the achieved MSVC is $\sim$ 1.11 times higher than the V $_{\mathbf{BD}}$ ( $\sim$ 14.8 V) of the substrate diode. The stimulator is also measured in a continuous output test mode for over 10 million cycles, the variation of $\vert$ MSVC $\vert$ is less than 200 mV.
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