34.1: Ultra‐Thin Encapsulation for Large‐Area OLED Displays

Abstract Organic light emitting displays (OLEDs) can be made as thin as the substrate if thin film packaging is used. We have developed an effective encapsulation method for OLED displays, based on a multi‐stack approach of silicon‐nitride (N) and silicon‐oxide (O) PECVD films as a barrier layer. We present results on the moisture resistance properties of this stack. The water permeability of a NONON stack was measured in the range of 10 −6 g/m 2 ⋅day.