Chemical Preparation of Metallic Cu Layer on Glass Substrate Using Intermediate Cu(OH)2/Cu(O, S) Bilayer

A metallic Cu layer with a sheet resistance of 0.19 Ω was chemically prepared on a glass substrate by chemical reduction of the intermediate Cu(OH) 2 /Cu(O,S) bilayers using dimethylamine-borane (DMAB), while Cu(OH) 2 , and Cu(O,S) layers were fabricated by a sequential chemical bath deposition (CBD) in aqueous solutions containing copper (II) nitrate hydrate and ammonium nitrate with urea and thiourea. The thickness of the Cu(OH) 2 and resultant Cu layers were strongly affected by the structure under the Cu(O, S) layer, and a metallic Cu layer was formed mainly from the Cu(OH) 2 layer. The reduction reactions of Cu(OH) 2 and Cu(O, S) were discussed based on thermodynamics.