共价键
半导体
材料科学
单层
金属键合
范德瓦尔斯力
接触电阻
化学键
图层(电子)
金属
纳米技术
过渡金属
化学物理
电接点
宽禁带半导体
范德瓦尔斯半径
晶片键合
联轴节(管道)
光电子学
作者
Li Gao,Zhangyi Chen,Zhenghui Fang,Shucao Lu,Xiaofu Wei,He Jiang,Kuanglei Chen,Xiaoyu He,Chao Chen,Wei Shangguan,Jinsen Shang,Huihui Yu,Mengyu Hong,Yang He,Xiankun Zhang,Zheng Zhang,Yue Zhang
出处
期刊:Science
[American Association for the Advancement of Science]
日期:2025-11-20
卷期号:390 (6775): 813-818
被引量:40
标识
DOI:10.1126/science.adz2405
摘要
Van der Waals contact between two-dimensional semiconductors and metals has always been inferior to covalent bond contacts used in semiconductor industry because of weak band coupling and low bond strength. Here, we report an atomic layer bonding (ALB) contact with strong band coupling and high interfacial cohesion by establishing a metallic coherent bonding interface between the transition-metal atomic layer of transition-metal dichalcogenides and metals. This contact exhibits ultralow contact resistance and superb thermomechanical stability, comparable to those of covalent bond contacts and surpassing all reported contact configurations. ALB contact formed in monolayer molybdenum disulfide and gold demonstrates a contact resistance of 70 ohm-micrometers and thermomechanical stability up to 400°C and delivers a maximum on-current of 1.1 milliamperes per micrometer after high-temperature annealing, all of which meet industrial integration.
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