Effective three-dimensional thermal conductivity networks in polystyrene/multi-walled carbon nanotubes/aluminum oxide@hexagonal boron nitride composites based on synergistic effects and isolated structures

材料科学 热导率 复合材料 氮化硼 碳纳米管 聚苯乙烯 电导率 热压 复合数 聚合物 化学 物理化学
作者
Zhengfang Wang,Zijian Wu,Najla AlMasoud,Ling Weng,Taghrid S. Alomar,Zeinhom M. El‐Bahy,Mingpeng He,Changjie Yang,Mingqi Sun,Priyanka Wasnik,Handong Li,Hassan Algadi,Sri Hari Kumar Annamareddy,Deepak Sridhar
出处
期刊:Advanced composites and hybrid materials [Springer Science+Business Media]
卷期号:6 (3) 被引量:40
标识
DOI:10.1007/s42114-023-00702-8
摘要

Enhancing the thermal conductivity (λ) of composites by establishing an effective thermally conductive path is the key to prepare thermally conductive composites. In this study, a new preparation method was used to achieve high λ of composites with low filler contents. Firstly, multi-walled carbon nanotubes (MWCNT) and alumina (Al2O3) established a synergistic thermal conductivity network in the polystyrene particles, and subsequently, the hexagonal boron nitride (h-BN) filler wrapped in the outer layer of the composite particles constructed a continuous h-BN thermal conductivity network during the hot-pressing process. The three-dimensional thermal conductivity network supported by the two thermal conductivity networks provided more pathways for heat transfer in the composite, thus significantly improving its λ. The λ of the composites increased to 3.36 W/mK for MWCNT content of 0.5 wt%, Al2O3 content of 0.5 wt%, and h-BN content of 30 wt%. The composite also has good insulating properties, with a conductivity value of only 3.21 × 10−9 S/cm at an h-BN content of 30 wt% and MWCNT content of 0.5 wt%. This results from the presence of a h-BN insulation layer on the outside of the composite sphere and the presence of Al2O3 in the synergistic network that blocks the electron transport inside the material, thus maintaining its good insulating properties. Therefore, the composite prepared in this paper has the potential to be used in the field of electronic packaging.
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