Lateral Punch-Through TVS Devices: Design and Fabrication

The design and fabrication of a novel lateral punch-through TVS (transient voltage suppressor) device addressed to on chip protection against ESD (electrostatic discharge) is reported in this paper. In order to reduce the breakdown voltage, the inclusion of a field place, connected to the collector, has been proposed for first time. The compatible CMOS technological process followed in the integration of this device and its technological and electrical characterization is large explained, being these results in agreement with the previous studies.