The effect of T/sub g/ on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling

The stress free state and deformation of an ACF flip chip assembly may depend upon the curing characteristics of the adhesive, but may also depend upon the temperature cycling history of the assembly after it was cured. The thermal deformation of an ACF flip chip assembly after curing and cooling-down processes is investigated. In-situ deformation behaviors of ACF flip-chip-on-board assembly under various temperature cycling regimes are investigated using high sensitivity moire interferometry. In particular, the effect of temperature cycling history on the thermal deformation and stress-free state and is discussed in detail. Results indicate that the T/sub g/ of ACF have a significant role in the thermal deformation and stress-free state during thermal cycling testing.