专用集成电路
计算机科学
功率(物理)
嵌入式系统
计算机硬件
集成电路
工程类
电路设计
系统集成
纵向一体化
组分(热力学)
集成电路设计
电气工程
输送系统
作者
Shenli Zou,Joan Wu,Satyam Saini,Yin Hang,Louie Lu,Jonathan Tang
标识
DOI:10.1109/apec51134.2026.11516750
摘要
In this paper, a customized vertical power delivery (VPD) module capable of delivering 850A at 0.85V for AI ASIC is designed, manufactured, and validated with carrier board. The solution follows a two-stage approach, with a fixed-ratio high-density high-efficiency first stage (UBC) and a second stage module integrated with VR controller achieving very high power density (0.8A/mm2, 1200W/inch3). Optimal design workflow targeting at transient response and power conversion efficiency is conducted. Its effectiveness is demonstrated by comprehensive manufacturing design of experiments (DOE) and full engineering validation, making it ready for pre-production adoption.
科研通智能强力驱动
Strongly Powered by AbleSci AI