Preparation and Characterization of Silver-Coated Copper Powder for Conductive Adhesives

The silver coated copper powders were prepared by electroless plating at room temperature.The powders were characterized using laser particle size analyzer,scanning electron microscopy and powder resistance test.The results show that by using this method,copper powders fully coated with silver can be obtained.The resistance of the powders decreases with the increasing of the mass fraction of silver on the coating surface.Flake-like powders obtained by ball milling can increase the conductivity of powders and reduce the filling mount of powder in condunctive adhesives.