Silicon electroosmotic micropumps for integrated circuit thermal management

We are developing a class of electroosmotic micropumps fabricated from silicon substrates that can be used for integrated circuit thermal management applications. Prototype micropumps with 0.15 cm/sup 3/ packages produce a maximum flow rate of 170 /spl mu/L min/sup -1/ and a maximum pressure of 10 kPa operating at 400 V. These specifications approach the requirements for single-phase forced-convective cooling of small IC hot spots. The micropumps operate on less than 200 mW and, having no moving structural elements, offer inherent reliability advantages. The impact on pump performance of geometry, surface treatment, and choice of working fluid has been characterized.