Electromigration failure in inkjet-printed Ag conductive lines

电迁移 导电体 材料科学 喷墨打印 阳极 阴极 小丘 印刷电子产品 静电放电 可靠性(半导体) 光电子学 纳米技术 墨水池 复合材料 电气工程 电压 化学 物理 功率(物理) 工程类 物理化学 量子力学 电极
作者
Prabhakar Jepiti,Sukeun Yoon,Jihoon Kim
出处
期刊:Flexible and printed electronics [IOP Publishing]
卷期号:8 (1): 015003-015003 被引量:2
标识
DOI:10.1088/2058-8585/acb277
摘要

Abstract Electromigration (EM) is crucial to the reliability of most conductive lines used in electronics. In the present study, the EM characteristics of inkjet-printed Ag conductive lines were analyzed under various EM acceleration conditions to comprehend the EM failure behaviors associated with inkjet-printed Ag lines with nanoparticle inks. The evolution of the porosity level in the microstructure of the inkjet-printed Ag lines during the EM test was investigated to locate the EM failure positions in the line and identify the main driving force for EM mass transport. Two theoretical models (resistometric and Black’s) were employed to analyze the activation energy and expected lifetime of inkjet-printed Ag lines. This study indicates that the EM of Ag cations is directed toward the cathode by the direct force resulting from the electric field–ion interaction, resulting in EM failure near the anode and hillock formation near the cathode of the inkjet-printed Ag lines. The activation energy computed from the theoretical models suggests that the surface diffusion of Ag through the inkjet-printed line plays an important part in the EM failure mechanism. This research was a pioneering attempt to experimentally investigate the EM performance of inkjet-printed Ag lines.
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