Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via Polysilazane

In this work, we investigate the effect of plasma hydrophilic treatment on room temperature wafer bonding using perhydropolysilazane (PHPS). Wafer bonding is a critical technique for electronics packaging, including hybrid bonding. This paper presents a method for room temperature wafer bonding via PHPS, where plasma treatment improves bond strength. Notably, N2 plasma treatment achieves higher bond strength compared to O2 plasma treatment. Surface analysis suggests that the adsorbed water introduced by plasma treatment plays an important role in enhancing bond strength. The proposed bonding method facilitates high-strength wafer bonding at room temperature.