High Performance Liquid Metal Thermal Interface Materials

ABSTRACT Modern electronics require an extremely large number of circuits to perform their many impressive feats. For example, a modern smartphone can have several billion logic circuits in the main microprocessor. This circuit density creates a significant amount of heat that must be dissipated. If the heat is not adequately dissipated, the life expectancy and performance of the circuits are significantly reduced. A revolution in thermal interface materials (TIMs) and designs has been a result of this necessary heat transfer. This paper will discuss the progress in this important field.