高电子迁移率晶体管
钻石
材料科学
光电子学
宽禁带半导体
萃取(化学)
氮化镓
化学
物理
晶体管
纳米技术
冶金
图层(电子)
色谱法
量子力学
电压
作者
Khush Gohel,Linhui Zhou,Swarnav Mukhopadhyay,Shubhra S. Pasayat,Chirag Gupta
标识
DOI:10.1088/1361-6641/ad4a66
摘要
Abstract High-power operation of high electron mobility transistors (HEMTs) is limited due to a variety of thermal resistances in HEMT devices that cause self-heating effects (SHEs). To reduce SHEs, diamond heat spreaders integrated in the device have proven efficient in extracting heat from the device. In this report, we use electrothermal technology computer-aided design simulations to demonstrate a qualitative understanding of multiway heat extraction utilizing diamond heat spreaders to improve HEMT thermal performance at high DC output power densities (∼40 W mm−1). The impact of each heat extraction pathway is understood while considering the thermal boundary resistance between the diamond/GaN heterointerface and optimization of the GaN buffer layer thickness. Using these findings, we simulate an AlGaN/GaN HEMT device operating at 40 W mm−1 DC output power and demonstrate significant reduction in the temperature.
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