Controllable Si micro-structuring by temporally modulated single-shot femtosecond pulse lithography

Micro-structured silicon surface plays a significant role in the electronics industry. Crystalline and amorphous phases of silicon, which have significantly different physical properties, can be transformed into each other using femtosecond laser, and assisted chemical etching enables the easy fabrication of various micro-structures. However, efficient and controllable fabrication of micro-cylinders, micro-rings, and micro-ring grooves on silicon surfaces still remains a challenge. Here, we propose a temporally modulated single-shot femtosecond pulse lithography technology, combining laser-induced silicon modification and chemical etching. In this technology, the occurrence of recrystallization allows for the flexible manipulation of the shape of the modified area, transitioning from circular to annular shapes by adjusting the laser fluence. This corresponds to the formation of micro-cylinders and micro-rings after etching. In the case of temporally shaped pulses, with an increasing pulse delay, the micro-rings formed after etching gradually transform into micro-ring grooves, as the recrystallization area created by the first sub-pulse is reacted by the second sub-pulse. Due to the characteristics of the single shot, the technology, when combined with the flying punch method, can be used for the high-efficiency fabrication of large-area silicon surface micro-structure arrays.