Three Dimensional Graphene/Copper Dual Networks as Composite Conductors with Enhanced Current Carrying Capacity

The resolution of electronic devices toward miniaturization and lightweight puts forward requirements for current carrying capacity and density of conductors. Composite conductors consisting of copper as the matrix material and nanocarbon as the filler have aroused great interest, which revealed apparently enhanced ampacity and low density compared to pure Cu. In this study, three-dimensional laser-induced graphene (LIG) was used as the nanocarbon filler to improve the ampacity of Cu by a two-step electrodeposition method. After organic Cu seeding and a subsequent aqueous densification process, a uniformly dispersed graphene/copper dual network composite was obtained. This composite exhibits an enhanced ampacity of 1.34 × 105 A/cm2 (increased 76% compared with pure Cu) and a low density of 3.27 g/cm2 (36.5% of pure Cu). Benefiting from the patterning preparation of laser direct writing technology, this method enables the creation of conductive lines with various desired carves. Thus, this graphene–Cu composite conductor would be useful to overcome the current limit in Cu conductors and cables for lightweight high-power electrical energy transfer devices.