材料科学
薄膜
结晶
微观结构
溅射沉积
相(物质)
电导率
薄脆饼
活化能
相变存储器
溅射
电阻率和电导率
镓
复合材料
化学工程
光电子学
纳米技术
冶金
图层(电子)
有机化学
化学
物理化学
工程类
电气工程
出处
期刊:Nanotechnology
[IOP Publishing]
日期:2020-02-07
卷期号:31 (21): 215709-215709
被引量:23
标识
DOI:10.1088/1361-6528/ab7429
摘要
In this work, we investigated the structural and conductivity stability of Ga-Sb thin films for phase change memory (PCM). The mass density and thickness change are significant for stability and reliability of PCM. The Ga-Sb thin films were deposited on SiO2/Si (100) wafer using magnetron co-sputtering method. Phase identification revealed that nanoscale face center cubic structure GaSb and rhombohedral structure Sb formed in Ga-Sb thin films, the formation of phase Sb was more obvious in Ga20Sb80. Ga-Sb film exhibits an unusual behavior upon crystallization with less mass density and thickness change. The microstructure of Ga45Sb55 thin films improved their structural (density and film thickness) characteristics: the crystal growth of {111} and {110} oriented grains in Ga-Sb thin films is obvious, the grains growth in Ga45Sb55 thin films was more even and the bonding states in Ga-Sb thin films were more stable. In addition, the conductivity activation energy of Ga-Sb decreased with increasing Sb contents, thus the temperature stability of conductivity was improved. The structure transformation and conductivity activation energy of Ga-Sb phase change materials are in favor of mechanical stresses reduction and reliability enhancement of PCM. This study introduces the influence mechanism of structural and conductivity stability in Ga-Sb thin films and may provide reference for further testing in higher endurance performance phase change materials.
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