High strength and high electrical conductivity in bulk nanograined Cu embedded with nanoscale twins

A bulk nanograined Cu sample embedded with nanoscale twins is produced by means of dynamic plastic deformation at cryogenic temperatures. It exhibits a tensile yield strength of 610MPa and an electrical conductivity of 95% IACS at room temperature. The unique combination of a high strength and a high conductivity is primarily attributed to the presence of a considerable amount of nanoscale twins which strengthen the material significantly while having a negligible influence on electrical conductivity.