高功率脉冲磁控溅射
溅射
材料科学
溅射沉积
腔磁控管
离子
沉积(地质)
工程物理
等离子体
光电子学
薄膜
化学
纳米技术
工程类
物理
核物理学
地质学
沉积物
古生物学
有机化学
作者
Xiang Yu,Chengbiao Wang,Yang Liu,Dongli Yu,Tingyan Xing
标识
DOI:10.1088/1009-0630/8/3/20
摘要
The principle of magnetron sputtering is introduced and the balanced and unbalanced magnetrons are compared and the necessity of unbalanced magnetrons is explained as well. Several recent developments in plasma magnetron sputtering, i.e., unbalanced magnetron sputtering, pulsed magnetron sputtering and ion assisted sputtering, are discussed. The recent developments of unbalanced magnetron systems and their incorporation with ion sources result in an understanding in growing importance of the magnetron sputtering technology, which makes the technology an applicable deposition process for a variety of important films, such as wear-resistant films and decorative films.
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