Tailoring Highly Thermal Conductive Properties of Te/MoS2 /Ag Heterostructure Nanocomposites Using a Bottom-Up Approach

Abstract Ever‐increasing packaging and power densities of modern electronic devices in the present “More‐than‐Moore” technology era demand higher performance thermal interface materials (TIMs). However, conventional composite TIMs require higher loading to achieve better thermal conductive property, resulting in a mechanical problem. The poor wetting property of matrix loading materials further increases the interfacial thermal resistance (ITR). In this work, a one‐step hydrothermal method is employed to grow 2D molybdenum disulfide (MoS 2 ) nanosheets on a tellurium (Te) nanowire skeleton and silver (Ag) nanoparticles are further decorated on MoS 2 nanosheets via the photoreduction method. The in‐plane thermal conductivity of the final nanocomposite reaches as high as 10.4 W m −1 K −1 , which is 4,160% higher than that of a pure epoxy resin and one order of magnitude higher than that of conventional polymeric nanocomposites. The 3D interconnected heat transferring network of Te/MoS 2 /Ag greatly enhances the thermal stability of the composite in practical applications. The rational materials design concept may contribute to the development of new types of high‐performance thermal management materials.