Study on the Process of the Copper Pyrophosphate Plating

The copper coating has been used as the middle or bottom layer of matrix material, and therefore the coating with some special properties can be obtained. Copper cyanide electroplating has been most widely used in the bottom copper plating, but the cyanide solution is severely poisonous. Copper pyrophosphate plating technology is a very important substitute of copper cyanide one, but one of the biggest problem is poor adhesion with the matrix. In this paper, by electrochemical methods, the effect of plating process on the properties(especially interaction force with the matrix)of copper coating has been studied. The results suggest that the bath temperature, stirring speed and current density affect the coating performance apparently.The optimal conditions of pyrophosphate copper eleetroplating are temperature (45℃), time (60 min), stirring speed (200 r/min), and cathode current density (1.5 A/dm2).