A high through-put image colorimeter for ultra-high-resolution micro-led panel inspection

With microLED panel technology quickly evolving to smaller pixel size and larger resolution, optical metrology is on-demand to support both design verification and process yield control by providing a solution with high resolving power high through-put and less calibration spectrum dependency. This paper reviews the trade-off between all conflicting factors, and discusses the calibration algorithm to remove the spectrum dependence, describes a novel imaging colorimeter which precisely attacks all above technology inconsistencies with the final goal of: single micron pixel resolving power by combination of optical resolution and digital imaging processing algorithm, large optical FOV to reduce number of frames to be captured for whole panel inspection, calibration algorithm to precisely transfer the true color and brightness information between NIST traceable light source without spectrum matching demand, and inherent final balanced high through-put image capturing.