Toward high thermal conductive aramid nanofiber papers: Incorporating hexagonal boron nitride bridged by silver nanoparticles

Abstract In this work, a novel thermal conductive and electrical insulation h‐BN@AgNPs/ANFs composite paper was fabricated by vacuum‐assisted filtration approach. Specifically, hexagonal boron nitride (h‐BN) was incorporated via polydopamine pretreatment and subsequent decoration by silver nanoparticles, which served as bridges to link neighboring h‐BN sheets. The results revealed that the thermal conductivity of as‐prepared composite paper increased to 1.032 W/m K with 40 wt% filler loading, about 464% higher than the pure ANFs paper, which was attributed to the efficient thermal conductive networks within the paper and strong interfacial combination through hydrogen bonding. Besides, the as‐prepared composite paper exhibited excellent mechanical property with the maximum tensile strength over 90 MPa, and good electrical insulation performance. More importantly, this work provided a promising strategy to achieve high thermal conductivity ANFs based composite paper by constructing efficient thermal conductive networks, which had potential to be used in the field of electronic packaging.