Photocrosslinker‐Based Direct Microlithography for Organic Electronic Devices: From Patterning Capability to Multifunctionality

ABSTRACT Organic electronic devices hold great promise in areas such as flexible wearables, bioelectronics, proactive health. However, achieving high‐resolution, large‐area‐compatible, and low‐cost patterning of functional layers remains a critical bottleneck for their practical application. Photocrosslinker‐based direct microlithography (DML) has emerged as a powerful and versatile approach to address this challenge, owing to its simplicity, broad compatibility, and material generality. This review systematically surveys the recent progress in DML‐enabled patterning for organic electronics, framing its development into three stages: structural integrity preservation, intrinsic material performance retention, and multifaceted performance optimization. Representative photocrosslinker systems applied to semiconducting, dielectric, and other functional layers are examined, and the specific requirements for each layer type are identified. Notably, recent research demonstrates that rationally designed photocrosslinkers not only enable high‐resolution patterning but also simultaneously enhance key properties such as electrical conductivity, mechanical stretchability, and stability. These synergistic improvements expand the functional landscape of organic materials and open new avenues for high‐performance, multifunctional organic devices.