多路复用器
CMOS芯片
多路复用
传感器
计算机科学
可穿戴计算机
可扩展性
超声波传感器
计算机硬件
电气工程
电子工程
嵌入式系统
工程类
电信
声学
物理
数据库
作者
Martijn Timmermans,Kyle van Oosterhout,Marco Fattori,P.L.M.J. van Neer,Pieter Harpe,Eugenio Cantatore
标识
DOI:10.1038/s41528-025-00478-5
摘要
Abstract Ultrasound (US) imaging is a fundamental tool in healthcare for the diagnosis of diverse conditions. Wearable, flexible ultrasound patches could expand the scope of US imaging to continuous, at-home monitoring without professional intervention, but require scaling to large numbers of transducer elements. This poses challenges in interconnect density, power consumption, and data bandwidth. To improve interconnect density, we present the first integration of flexible ultrasound transducers with flexible a-IGZO thin-film transistor (TFT) multiplexing electronics. In the Si CMOS readout chip, a new circuit technique cuts front-end power, while a log-delta ADC compresses data efficiently. Our system achieves an 8× reduction in required front-end circuitry and a 42% decrease in front-end power. The data needed to describe the ultrasound image are reduced five-fold, decreasing data transmission power by the same factor. These advances bring the vision of wearable high-density, large-area ultrasound imaging patches for monitoring one step closer.
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