材料科学
电场
表面改性
化学工程
工程类
物理
量子力学
作者
Jin Wook Yang,Yixuan Hou,Yingzheng Hong,Yingbang Yao
摘要
Abstract Since thermally conductive fillers easily aggregate when introduced into polymer matrix, it is essential to apply a modifier to enhance the dispersion of the filler. In current study, the surface of boron nitride (h‐BN) is firstly modified by employing a double modification process and then added into sulfonated polyetheretherketone (SPEEK) to form the composite materials. Four different kinds of samples of double‐modified h‐BN were obtained. Ultimately, the XXX@h‐BN/SPEEK (XXX denoted as modifier, i.e. PDA, VTMS, TEOS, and APS) flexible film with the horizontally oriented XXX@h‐BN was produced by heating the mixture under an external electric field. The test results indicate that the thermally conductive filler PDA@h‐BN (PDA: polydopamine), which was prepared by modifying OH@h‐BN with PDA, loaded into SPEEK, and electrically oriented, shows the best overall performances. With a high tensile strength of 43.24 MPa and good flexibility, PDA@h‐BN/SPEEK flexible film exhibits an in‐plane thermal conductivity of 2.3 Wm −1 K −1 at a filling ratio of 10 wt%. The sample may be bent at a steep angle without breaking down and can recover to original shape bearing its high degree of flexibility.
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