Wire arc direct energy deposited multiphase steel through in situ micropowder alloying: mechanical and metallurgical studies

冶金 材料科学 原位 弧(几何) 机械工程 工程类 物理 气象学
作者
Adarsh Prakash,Sachin D. Kore
出处
期刊:Rapid Prototyping Journal [Emerald (MCB UP)]
卷期号:31 (1): 62-82 被引量:5
标识
DOI:10.1108/rpj-02-2024-0094
摘要

Purpose This study aims to investigate the effect of copper and titanium micropowder addition on the mechanical and metallurgical properties of additively manufactured low-carbon steel, aiming to produce a modified (multiphase) steel with ferritic low-carbon steel using in situ micropowder addition during wire arc direct energy deposition (WA-DED). Design/methodology/approach A robotic arm equipped with a GMA welding source deposited ER70S6 filler wire on AISI S235 substrate steel using WA-DED. Cu and Ti micropowders were interspersed between layers for microstructural modifications. Microscopy, spectroscopy, diffraction and mechanical testing were used to evaluate the properties of the deposited samples. Findings Incorporating Cu and Ti micropowders significantly enhanced the yield and tensile strength of the deposited material, showing an 83% increase in yield strength and a 33% increase in tensile strength. Microstructural analysis identified key phases such as ferrite, pearlite, bainite, retained austenite and martensite/austenite, with Cu and Ti acting as grain refiners. Nanoscaled Cu precipitates contribute to enhanced low-temperature toughness and a 150% improvement in impact strength at −30°C. Originality/value This study presents a novel approach to overcome the limitations of the available alloys (filler materials). This can be achieved by introducing in situ micropowder alloying during the WA-DED process. The micropowder addition allows altering the properties of the deposited material without changing the parent filler material itself, achieving the desired composition. With this approach, there is no need to manufacture the filler material with the preferred alloy composition separately and then carry out the deposition process.

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