Integrated Thermal and Power Delivery Network Co-Simulation Framework for Single-Die and Multi-Die Assemblies

This paper presents a thermal and power delivery network (PDN) co-simulation framework for single-die and emerging multi-die configurations that incorporates the interactions between temperature, supply voltage, and power dissipation. The temperature dependencies of wire resistivity and leakage power are considered, and the supply voltage dependencies of power dissipation are modeled. Starting with a reference power dissipation, the framework is capable of evaluating the temperature distribution and PDN noise simultaneously and eventually updating the power dissipation based on the thermal and supply voltage distributions. The simulation results of an example two-tier 3-D stack show that prior models considering only part of the interactions between temperature, supply voltage, and power dissipation have a maximum error of 7.66%, 9.79%, and 4.64% in IR-drop, transient power supply noise, and temperature, respectively.