Nucleation kinetics analysis of Ni-SiC composite film during early electrocrystallization processes

The electroplating behavior of fabricating Ni-SiC composite film(NS) was investigated using chronoamperometry method in conjunction with the cyclic voltammetry method.The results show that,in the case of lower electroplating negative voltage,the co-deposition of Ni-SiC film follows a 3-D progressive nucleation/growth mechanism.While in the case of higher electroplating negative voltage,it follows a 3-D instantaneous nucleation/growth mechanism.However,either Ni-SiC co-deposition coatings or pure Ni coatings,the nucleation relaxation time tm decreases regularly with the increase of the negative potential,while the corresponding current Im are almost in the same quantity.Obviously,because of addition of SiC powder,the nucleation potential of Ni turns to positive direction,and the nucleation relaxation time tm decreases clearly.